Device for processing substrate device

专利名称：Device for processing substrate device发明人：魚岸 広太,山田 一幸,古和田 健吾申请号：JP2018174265申请日：20180918公开号：JP2020047738A公开日：20200326

专利附图：

摘要：Problem to be solved: to provide a processing apparatus for a substrateapparatus capable of uniformly controlling a projecting amount of the bent portion fromthe main body of the substrate apparatus by bending the flexible wiring substrate stably.The machining apparatus 10 comprises a mounting table 70, a fixed portion 66, a movable

part 67, and a crimping portion 63.The mounting table 70 mounts the substrate device 11on which the flexible wiring substrate 16 is mounted.The fixing portion 66 fixes thesecond end of the substrate device 11 opposite to the first end of the flexible wiringsubstrate 16.The movable portion 67 is provided to be movable back and forth withrespect to the fixing portion 66, and the flexible wiring board 16 is pressed against thefixing portion 66 at the first end of the substrate device 11.The crimping portion 63presses the flexible wiring substrate 16 against the substrate device 11.Diagram

申请人：株式会社ジャパンディスプレイ

地址：東京都港区西新橋三丁目７番１号

国籍：JP

代理人：樺澤 襄,樺澤 聡,山田 哲也

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